The UC Davis Facility for Interconnect Technology is equipped for bonding and testing various types of interconnect technology. Mainly, we investigate gold stud bump bonding, anisotropic conductive film (ACF), various types of solder balls, indium studs, various types of interposers, and solder paste.

The Westbond Manual Wire Bonder allows us to place gold studs for gold stud bump bonding (also called ball bonding) and aluminum wire for die bonding.

The Fineplacer pico ma is a multi-purpose flip chip die bonder.

The Signatone Probe Station-S1160 allows for characterization of bonds and various circuitry.