http://fit.physics.ucdavis.edu/ 2012-02-25T20:20:07-08:00 http://fit.physics.ucdavis.edu/ http://fit.physics.ucdavis.edu/lib/images/favicon.ico text/html 2012-02-21T11:53:26-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:publications&rev=1329854006&do=diff The following is a list of publications written by the UC Davis Interconnect Technology team: * Further Developments in Gold-stud Bump Bonding - (arXiv preprint) * Development of readout interconnections for the Si-W calorimeter of SiD * Gold-stud bump bonding for HEP applications text/html 2012-02-15T19:05:49-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:techniquest&rev=1329361549&do=diff The UC Davis Facility for Interconnect Technology is equipped for bonding and testing various types of interconnect technology. Mainly, we investigate gold stud bump bonding, anisotropic conductive film (ACF), various types of solder balls, indium studs, various types of interposers, and solder paste. text/html 2012-02-15T19:03:10-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:solder&rev=1329361390&do=diff The International Linear Collider is a proposed e+e- collider designed for precision physics at the energy frontier. The SiD concept, one of the two designs for particle detectors being designed and developed, includes a Si-W electromagnetic tracking calorimeter [1]. It features a thin onion-skin construction of detection (silicon) and interaction (tungsten) layers, allowing for implementation of particle flow algorithms. The requirements of high granularity and thin readout layer are simultaneo… text/html 2012-02-15T18:52:20-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:finetech&rev=1329360740&do=diff UCD-FIT houses a Finetech “Fineplacer pico ma” aligner-bonder which is a multipurpose die bonder with 5 m accuracy and repeatability. A single camera views both the substrate and package simultaneously using a rigid beam splitter. Engineered stability of the design guarantees that once the substrate material’s position and angle visually overlaps that of the upper die, this orientation is maintained throughout the process of rotating the die with respect to the substrate and bonding them. The o… text/html 2012-02-15T15:56:51-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:5_mil_studs&rev=1329350211&do=diff The UC Davis Facility for Interconnect Technologies (UCD-FIT) has been developing methods for removing the negative aspects of gold-studs, in order to make them a viable option for a wide variety of prototyping needs. This paper explores double gold-stud bonding as a method of reducing the bonding stresses, and 0.5 mil gold wire studs as a technique for bonding smaller devices. text/html 2012-02-15T15:46:46-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:double_gold_studs&rev=1329349606&do=diff Conventional gold bump bonding requires one of the bonding chips to be prepared with gold studs. Double gold stud bump bonding requires both chips to be studded with gold, coined, and then bonded. While this adds extra steps to the bonding process, this technique remedies several draw-backs for conventional single gold stud bump bonding. The typical pressure and temperature required for thermo-compression can be hazardous to sensitive circuitry. Also, devices that require a very high numbers… text/html 2012-02-15T15:31:19-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:indium&rev=1329348679&do=diff Coming soon! text/html 2012-02-15T15:30:43-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:acf&rev=1329348643&do=diff Coming soon! text/html 2012-02-15T15:30:01-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:solder_paste_dispenser&rev=1329348601&do=diff Coming soon! text/html 2012-02-15T15:29:44-08:00 fit http://fit.physics.ucdavis.edu/doku.php?id=shared:re-flow_oven&rev=1329348584&do=diff Coming soon!