The following is a list of publications written by the UC Davis Interconnect Technology team:

• Further Developments in Gold-stud Bump Bonding - (arXiv preprint)

• Development of readout interconnections for the Si-W calorimeter of SiD

• Gold-stud bump bonding for HEP applications

• Beam test results ofthe US-CMS forward pixel detector

• Test of Silicon Hybrid Pixel Detector in 15-GeV Electron Beam